產(chǎn)品詳情
晶圓切割膠帶
信息內(nèi)容
晶圓切割膠帶 - Pressure Sensitive Series -
|
|
|
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
|
|
Feature
● Various product line
● standard type (AD series)
● high-perbance to difficult-to-adhere workpiece (ＧＤ series)
● excellent stability against elapsed deterioration (Ｔ series)
● high-perbance to laser-dicing (F-90)
● Easy pick-up with excellent expandability
|
Specification
|
Recommended Works
|
Part Number
|
Base
Film
|
Color
|
Thickness (μm)
|
Adhesion Thickness (μm)
|
Adhesive Strength (N/20mm)
|
Probe Tack (N/20mm2)
|
Feature
|
Si
GaAs
Other Semiconductor
|
F-90MW
|
PO
|
MW
|
90
|
10
|
1
|
1
|
PVC-free type
|
|
T-80MW
|
PVC
|
80
|
0.8
|
0.7
|
Excellent temporal stability
|
|
T-80HW
|
1.7
|
1
|
|
T-120HW
|
120
|
1.7
|
1
|
|
Thick Workpiece
|
20GE-200
|
LB
|
200
|
2.7
|
2.9
|
For thick workpiece
|
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
＊Separator thickness is not included.
|
晶圓切割膠帶 - UV Series -
|
|
|
A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece. Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation. Elegrip dicing tapes can correspond with anti-static requirement. Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other b.
We Toyo Adtec consider needs of each user and choose appropriate tapes.
|
|
Feature
● Excellent control to back-side chipping and chip fly-off.
● Excellent adhesiveness.
● Smooth peeling by UV.
● High perbance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.
|
|
Recommended
Work I
|
Si
GaAs
Other Semi conductor
|
|
Part Number
|
UDV-
80J
|
UDV-
100J
|
UHP-
110B
|
UHP-
0805MC
|
UHP-
1005M3
|
UHP-
110M3
|
|
基材
|
PVC
|
PO
|
|
顏色
|
T
|
MW
|
|
總厚度 (μm)
|
80
|
100
|
110
|
85
|
105
|
110
|
|
黏著力 (μm)
|
10
|
5
|
10
|
|
Adhesive Strength (N/20mm)
|
3.8(0.2)
|
3.8(0.2)
|
2.9(0.2)
|
5.0(0.2)
|
5.0(0.2)
|
7.6(0.2)
|
|
Probe Tack (N/20mm2)
|
2.1(0.05)
|
2.1(0.05)
|
2.7(0.05)
|
1.7(0.05)
|
2.7(0.05)
|
3.9(0.05)
|
|
特性
|
Easy pickup
|
For less chipping
|
For small size chips
|
Recommended
Work II
|
Package
|
|
Part Number
|
UHP-1025M3
|
UHP-1510M3
|
UHP-1525M3
|
USP-1515M4
|
USP-1515MG
|
|
基材
|
PO
|
|
顏色
|
MW
|
|
總厚度 (μm)
|
125
|
160
|
175
|
165
|
|
黏著力 (μm)
|
25
|
10
|
25
|
15
|
|
Adhesive Strength (N/20mm)
|
12.0(0.2)
|
6.5(0.2)
|
13.5(0.2)
|
14.5(0.2)
|
15.0(0.2)
|
|
Probe Tack (N/20mm2)
|
5.5(0.05)
|
4.2(0.05)
|
5.6(0.05)
|
6.2(0.05)
|
5.9(0.05)
|
|
特性
|
For encapsulated workpiece
For less backside burrs
For less glue scratch-up on the chip side walls
For less against residue onto a making area
|
Recommended
Work III
|
Glass
Crystal
|
|
Part Number
|
UDT-1025MC
|
UDT-1325D
|
UDT-1915MC
|
|
基材
|
PET
|
|
顏色
|
T
|
|
總厚度 (μm)
|
125
|
155
|
203
|
|
黏著力 (μm)
|
25
|
15
|
|
Adhesive Strength (N/20mm)
|
30.0(0.2)
|
20.4(0.2)
|
20.3(0.2)
|
|
Probe Tack (N/20mm2)
|
7.5(0.05)
|
6.7(0.05)
|
5.9(0.05)
|
|
特性
|
-
For less backside cracking
|
-
For encapsulated workpiece
|
-
For less backside cracking
|
＊( ) is adhesive strength after UV.
＊The above data is just for representing value, and not guaranteed value.
＊Static type is lined up.
＊Color : MW (Milky White), T (Transparent)
＊UV irradiate condition : Light volume=above 150mJ/cm2.
＊UV irradiate condition may change with dicing products.
＊Separator thickness is not included.
|
咨詢電話0769-33398167傳真0769-81660126王小姐15377723326，QQ1779529894
