產(chǎn)品詳情
DDR4 Ultra Temperature SODIMM
產(chǎn)品特色
-
Small Outline Dual In-line Memory Module
-
Fully Tested and Optimized for Stability and Perbance
-
Uses Original IC to Meet Strict Industrial Standards
-
Anti-Sulfuration Protection Against Harsh Environments
-
JEDEC Standard 1.2V (1.26V~1.14V)
-
Operating Environment: -40°C ~ 125°C
-
45μ” Gold Finger
-
RoHS Compliance
-
CE/FCC Certification
-
Drop Test ISTA-1A (International Safe Transit Association)
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Gold Finger Insert & Extract 100 times
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Thermal Shock (MIL-STD-810G)
Overview:
DDR4 Ultra-temperature SODIMM offers a compact design and the industry's fastest memory speed with 3200MT/s - the perfect fit for any in-vehicle, surveillance, automation and bded application. The modules comply with all relevant JEDEC standards, can operate in temperatures from -40oC to 125oC, and are available in 16GB and 32GB capacities. 2133MT/s, 2400MT/s 2666MT/s and 2933MT/s modules are also available.
規(guī)格:
Interface
DDR4
Data Rate
2133 MT/s, 2400 MT/s, 2666 MT/s, 2933 MT/s, 3200 MT/s
Capacity
16GB, 32GB
Function
Non-ECC Unbuffered Memory
Pin Number
260pin
Width
64Bits
Voltage
1.2V
PCB Height
1.18 Inches
Operating Temperature
-40°C to 125°C
45μ” Gold Finger
Y
Anti-Sulfuration
Y
產(chǎn)品料號(hào):
Density
Component
Comb
Part Number
Rank
Voltage
Debion
16GB
1GX8
M4S0-AGM1OEEM
2Rx8
1.2V
DDR4 3200 Ultra Temperature SODIMM
32GB
2GX8
M4S0-BGM2OEEM
2Rx8
1.2V
DDR4 3200 Ultra Temperature SODIMM
- Small Outline Dual In-line Memory Module
- Fully Tested and Optimized for Stability and Perbance
- Uses Original IC to Meet Strict Industrial Standards
- Anti-Sulfuration Protection Against Harsh Environments
- JEDEC Standard 1.2V (1.26V~1.14V)
- Operating Environment: -40°C ~ 125°C
- 45μ” Gold Finger
- RoHS Compliance
- CE/FCC Certification
- Drop Test ISTA-1A (International Safe Transit Association)
- Gold Finger Insert & Extract 100 times
- Thermal Shock (MIL-STD-810G)
Overview:
規(guī)格:
Interface | DDR4 |
Data Rate | 2133 MT/s, 2400 MT/s, 2666 MT/s, 2933 MT/s, 3200 MT/s |
Capacity | 16GB, 32GB |
Function | Non-ECC Unbuffered Memory |
Pin Number | 260pin |
Width | 64Bits |
Voltage | 1.2V |
PCB Height | 1.18 Inches |
Operating Temperature | -40°C to 125°C |
45μ” Gold Finger | Y |
Anti-Sulfuration | Y |
產(chǎn)品料號(hào):
Density |
Component Comb |
Part Number | Rank | Voltage | Debion |
16GB | 1GX8 | M4S0-AGM1OEEM | 2Rx8 | 1.2V | DDR4 3200 Ultra Temperature SODIMM |
32GB | 2GX8 | M4S0-BGM2OEEM | 2Rx8 | 1.2V | DDR4 3200 Ultra Temperature SODIMM |